Redesigned ‘End-of-Life’ device for radar signal processing
Mixed signal ASIC – analog and digital functions on-chip
Selected fab process to optimize performance and cost
First silicon success
Mil/Aero Lifecycle Management
Three ICs were designed to replace obsolete (End-of-Life) devices
Driver and Receiver chips were designed from specifications
The receiver was designed to withstand +/- 1KV lightening strike
EOL custom SRAM was designed to meet the performance and size requirements of the previous chip.
Fab chosen to optimize performance and cost
IR camera for Mil/Aero Company
This project was a multi-year effort comprised of reverse engineering existing VHDL/Verilog RTL, adding new functions and delivering an FPGA based software development platform, followed by an ASIC and finally a 1” square PCB with a 3-D die stack, incorporating the ASIC, FLASH, DRAM, IR sensor stack, plus Voltage regulators, interface and support circuitry. The documentation was updated at the end of the project to meet Mil/Aero standards.
IR camera signal processing IC
Specifications were developed by iSine with input from Mil/Aero Co.
Architectural collaboration targeted minimum size and power, while meeting challenging system performance goals
Combination of reverse engineering incomplete existing core functions and new design for additional features
The design was created using primarily VHDL with some 3rd party Verilog RTL in a format that was targetable to both FPGA and ASIC
A full suite of production test vectors for ASIC were delivered.
The full suite of automated functional tests was provided.
FPGA Brassboard verification platform including integration with customer's system components for validating system function and performance
ASIC development using mixed VHDL/Verilog, IP core integration, verification, place & route, DRC, STA, test, release to IBM fab
Parts were verified in system by iSine & customer
First silicon success!
PCB design and development
Circuit assembly for minimum size (~1” on a side)
Prototype board developed to verify functionality and performance (large footprint ~6” on side - to allow ease of probing, and test)
Production board created following verification of the prototype board
3-D die stacking of ASIC, FLASH, DDR RAM on one side, and IR sensor stack on the other side
100 tested boards delivered for demonstration purposes and pre-production