iSine will help you choose the most cost effective technology for your chip. We will do the chip design, FAB, package, and test, and drop ship small, medium, or large volumes of product direct to your customers. iSine is ITAR registered.
iSine uses CMOS, SOI, BiCMOS technologies that are available from various domestic or overseas production facilities. The process node, from 1.0µm to as low as 28nm, is chosen to lower costs and improve performance. Our favorite foundries are XFab, TSMC, Global Foundries, Vanguard and SMIC.
iSine uses provides large standard package selection or custom package design and drawings. Die can be wire bonded, flip-chipped, or bare. We can write and debug test programs for production testing at either domestic or overseas test houses.
iSine will track products and work to reduce costs. Orders are placed with active supply chain management for on-time deliveries.