Fabless Production

Turnkey ASIC Service

iSine will help you choose the most cost effective technology for your chip. We will do the chip design, FAB, package, and test, and drop ship small, medium, or large volumes of product direct to your customers. iSine is ITAR registered.

Processes

iSine uses CMOS, SOI, BiCMOS technologies that are available from various domestic or overseas production facilities. The process node, from 1.0µm to as low as 28nm, is chosen to lower costs and improve performance. Our favorite foundries are XFab, TSMC, Global Foundries, Vanguard and SMIC.

Test and Packaging

iSine uses provides large standard package selection or custom package design and drawings. Die can be wire bonded, flip-chipped, or bare. We can write and debug test programs for production testing at either domestic or overseas test houses.